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ECOOP /
Committees
Executive Committee
Conference Chair
Rachid Guerraoui, EPFL, Switzerland
Program Chair
Luca Cardelli, Microsoft Research, UK
Organizing Chair
Mira Mezini, Darmstadt University of Technology, Germany
Organizing Committee
Workshop Chairs
Alejandro Buchmann, Darmstadt University of Technology, Germany
Frank Buschmann, Siemens Corporate Technology, Germany
Tutorial Chairs
Max Mühlhäuser, Darmstadt University of Technology, Germany
Krzysztof Czarnecki, DaimlerChrysler Research, Germany
Exhibition Chair / Industrial Track Chair
Michael Stal, Siemens Corporate Technology, Germany
Doctoral Symposium Chairs
Erik Ernst, University of Aahrus, Denmark
Lodewijk Bergmanns, University of Twente, Holland
Poster and Demo Chairs
David Lorenz, Northeastern University, USA
Thomas Kühne, Darmstadt University of Technology, Germany
General Conference Organization
Christoph Bockisch, Darmstadt University of Technology, Germany
Vasian Cepa, Darmstadt University of Technology, Germany
Michael Eichberg, Darmstadt University of Technology, Germany
Michael Haupt, Darmstadt University of Technology, Germany
Gudrun Jörs, Darmstadt University of Technology, Germany
Sven Kloppenburg, Darmstadt University of Technology, Germany
Klaus Ostermann, Darmstadt University of Technology, Germany
Program Committee
Mehmet Aksit, University of Twente, The Netherlands
Suad Alagic, University of Southern Maine, USA
Elisa Bertino, University of Milano, Italy
Andrew Black, Oregon Health & Science University, USA
Vinny Cahill, Trinity College Dublin, Ireland
Theo D'Hondt, Vrije Universiteit Brussel, Belgium
Peter Dickman, University of Glasgow, UK
Sophia Drossopoulou, Imperial College, UK
Urs Hoelzle, University of California at Santa Barbara, USA
Atsushi Igarashi, Kyoto University, Japan
Mehdi Jazayeri, Technical University of Vienna, Austria
Eric Jul, DIKU, University of Copenhagen, Denmark
Doug Lea, State University of New York at Oswego, USA
Gary T. Leavens, Iowa State University, USA
Jørgen Lindskov Knudsen, Mjølner Informatics, Denmark
Boris Magnusson, Lund Institute of Technology, Sweden
Mira Mezini, Technische Universität Darmstadt, Germany
Oscar Nierstrasz, University of Berne, Switzerland
Martin Odersky, Ecole Polytechnique Federale de Lausanne, Switzerland
Jens Palsberg, Purdue University, USA
John Reppy, University of Chicago, USA
Jan Vitek, Purdue University, USA
Guy Steele, Sun Microsystems Labs
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ECOOP is sponsored by
in cooperation with ACM SIGPLAN
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