ECOOP / Technical Papers

The ECOOP 2003 conference invites high quality papers reporting research results and/or experience related to object technology. The conference will in particular welcome novel contributions based on new ideas and/or new areas for OO technology. The program committee will evaluate each contributed research and experience paper based on its relevance, novelty, significance, clarity, originality, and correctness. Research papers should describe work that advances the current state of the art. Experience papers should be of broad interest and should describe insights gained from practical application of object technology - of use to other researchers and practitioners. Papers must be written in English, and not longer than 10,000 words. Papers arriving late or clearly longer than the limit may be rejected immediately by the Program Chair. In any case, the referees will be allowed to ignore, for the purpose of their evaluation, any material exceeding the 10,000 words limit.

Guidelines

Technical papers should be electronically submitted through the ECOOP 2003 online submission system (cyberchair.ecoop.org). Other submissions will not be accepted. For information about formatting your paper please consult the Springer LNCS webpage

Please notice that ECOOP, along with other scientific conferences, accepts only original papers that have not been published (and are not under review for publication) elsewhere. Any double submissions will be rejected without review, and the other forum will be informed of the situation.

Important dates

Submissions

For information about paper submission, contact

Luca Cardelli
ECOOP 2003 Program Chair
Microsoft Research
7 J J Thomson Avenue
Cambridge CB3 0FB, UK
Tel: +44 1223 479 782
Fax: +44 1223 479 999

Program Committee

Mehmet Aksit, University of Twente, The Netherlands
Suad Alagic, University of Southern Maine, USA
Elisa Bertino, University of Milano, Italy
Andrew Black, Oregon Health & Science University, USA
Vinny Cahill, Trinity College Dublin, Ireland
Theo D'Hondt, Vrije Universiteit Brussel, Belgium
Peter Dickman, University of Glasgow, UK
Sophia Drossopoulou, Imperial College, UK
Urs Hoelzle, University of California at Santa Barbara, USA
Atsushi Igarashi, Kyoto University, Japan
Mehdi Jazayeri, Technical University of Vienna, Austria
Eric Jul, DIKU, University of Copenhagen, Denmark
Doug Lea, State University of New York at Oswego, USA
Gary T. Leavens, Iowa State University, USA
Joergen Lindskov Knudsen, Mjoelner Informatics, Denmark
Boris Magnusson, Lund Institute of Technology, Sweden
Mira Mezini, Darmstadt University of Technology, Germany
Oscar Nierstrasz, University of Berne, Switzerland
Martin Odersky, Ecole Polytechnique Federale de Lausanne, Switzerland
Jens Palsberg, Purdue University, USA
John Reppy, University of Chicago, USA
Guy Steele, Sun Microsystems Labs
Jan Vitek, Purdue University, USA

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